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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MBRS1100T3/D
Designer'sTM Data Sheet
Schottky Power Rectifier
Surface Mount Power Package
Schottky Power Rectifiers employ the use of the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. These state-of-the-art devices have the following features: * * * * * * Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction High Blocking Voltage -- 100 Volts 150C Operating Junction Temperature Guardring for Stress Protection
MBRS1100T3
Motorola Preferred Device
SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 100 VOLTS
Mechanical Characteristics * Case: Epoxy, Molded * Weight: 95 mg (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable * Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds * Shipped in 12 mm Tape and Reel, 2500 units per reel * Polarity: Notch in Plastic Body Indicates Cathode Lead * Marking: B110 MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current TL = 120C TL = 100C Symbol VRRM VRWM VR IF(AV) IFSM TJ dv/dt
CASE 403A-03
Value 100
Unit Volts
1.0 2.0 50 - 65 to +150 10
Amps Amps C V/ns
Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature Voltage Rate of Change
THERMAL CHARACTERISTICS
Thermal Resistance -- Junction to Lead (TL = 25C) RJL 22 C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (1) (iF = 1.0 A, TJ = 25C) Maximum Instantaneous Reverse Current (1) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 100C) (1) Pulse Test: Pulse Width = 300 s, Duty Cycle 2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value. Designer's Data for "Worst Case" Conditions -- The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves -- representing boundaries on device characteristics -- are given to facilitate "worst case" design.
VF iR
0.75
Volts mA
0.5 5.0
Rev 2
(c)RectifierInc. 1996 Data Motorola, Device
1
MBRS1100T3
TYPICAL ELECTRICAL CHARACTERISTICS
i F, INSTANTANEOUS FORWARD CURRENT (AMPS) 20 10 5 2 1 0.5 0.2 0.1 0.05 0.02 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 100C 25C TJ = 150C 1K 400 200 100 40 20 10 4 2 1 0.4 0.2 0.1 0.04 0.02 0.01
I R , REVERSE CURRENT ( A)
TJ = 150C 125C 100C
0
10
20
30
40
50
60
70
80
90
100
vF, INSTANTANEOUS VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
PF(AV), AVERAGE POWER DISSIPATION (WATTS)
Figure 2. Typical Reverse Current
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SQUARE WAVE DC TJ = 100C
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 140 160 RATED VR APPLIED RJL = 22C/W TJ = 100C DC SQUARE WAVE
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
TL, LEAD TEMPERATURE (C)
Figure 3. Power Dissipation
Figure 4. Current Derating, Lead
280 260 240 220 200 180 160 140 120 100 80 60 40 20 0
NOTE: TYPICAL CAPACITANCE NOTE: AT 0 V = 270 pF
C, CAPACITANCE (pF)
0.1
0.2
0.5
1
2
5
10
20
50
100
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Typical Capacitance
2
Rectifier Device Data
MBRS1100T3
INFORMATION FOR USING THE SMB SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.089 2.261
0.108 2.743
0.085 2.159
inches mm
MOUNTING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C.
* The soldering temperature and time shall not exceed * When shifting from preheating to soldering, the maximum * After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. temperature gradient shall be 5C or less. 260C for more than 5 seconds.
Rectifier Device Data
3
MBRS1100T3
PACKAGE DIMENSIONS
S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
D
B
C
INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220
MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59
K
P
J
H
CASE 403A-03 ISSUE B
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303-675-2140 or 1-800-441-2447 JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. 81-3-5487-8488
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MBRS1100T3/D Rectifier Device Data

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